BMI-C-001-SN

Hersteller-Teilenummer
BMI-C-001-SN
Hersteller
Laird - Performance Materials
Paket/Karton
-
Datenblatt
BMI-C-001-SN
Beschreibung
SP CON S SN TNR
Lagerbestand
35000

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Hersteller :
Laird - Performance Materials
Produktkategorie :
RF/IF and RFID > RFI and EMI - Contacts, Fingerstock and Gaskets
Attachment Method :
Solder
Material :
Beryllium Copper
Operating Temperature :
-
Plating :
Tin
Plating - Thickness :
-
Product Status :
Active
Shape :
-
Type :
Shield Finger
Datenblätter
BMI-C-001-SN

Herstellerbezogene Produkte

  • Laird - Performance Materials
    BATT CONTACT SOLID 1 CELL SMD
  • Laird - Performance Materials
    CONN EMI GASKET BLUE
  • Laird - Performance Materials
    CONN SHIELDING FOR DB15
  • Laird - Performance Materials
    FILTER BLOCK 9 POS D-SUB
  • Laird - Performance Materials
    FILTER BLOCK 15 POS D-SUB

Katalogbezogene Produkte

  • TE Connectivity AMP Connectors
    SPRING FINGER 1.2H
  • Harwin
    RFI SHIELD CLIP MINI TIN SMD
  • Harwin
    SMT RFI CLIP 1900/TR (T&R)
  • Harwin
    RFI SHIELD CLIP MICRO TIN SMD
  • TE Connectivity AMP Connectors
    PRE-LOADED SPRING FINGER 2.15MM

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