A14162-33
- Référence fabricant #
- A14162-33
- Fabricant
- Laird - Performance Materials
- Colis/Boîte
- -
- Fiche technique
- A14162-33
- Description
- THERM PAD 228.6MMX228.6MM GRAY
- Stock
- 35000
Demander un devis (RFQ)
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- * Société:
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- Fabricant :
- Laird - Performance Materials
- Catégorie de produit :
- Fans, Thermal Management > Thermal - Pads, Sheets
- Adhesive :
- Tacky - Both Sides
- Backing, Carrier :
- -
- Color :
- Gray
- Material :
- Silicone Elastomer
- Outline :
- 228.60mm x 228.60mm
- Product Status :
- Obsolete
- Shape :
- Square
- Thermal Conductivity :
- 1.1W/m-K
- Thermal Resistivity :
- 3.31°C/W
- Type :
- Gap Filler Pad, Sheet
- Usage :
- -
- Fiches techniques
- A14162-33
Produits liés au fabricant
Produits liés au catalogue
Produits associés
| Partie | Fabricant | Stock | Description |
|---|---|---|---|
| A14100A-1BG313C | Microsemi | 35,000 | IC FPGA 228 I/O 313BGA |
| A14100A-1CQ256B | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256C | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256M | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-1PG257B | Microsemi | 35,000 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257C | Microsemi | 35,000 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257M | Microsemi | 35,000 | IC FPGA 228 I/O 257CPGA |
| A14100A-1RQ208C | Microsemi | 35,000 | IC FPGA 175 I/O 208RQFP |
| A14100A-1RQ208I | Microsemi | 35,000 | IC FPGA 175 I/O 208RQFP |
| A14100A-BG313C | Microsemi | 35,000 | IC FPGA 228 I/O 313BGA |
| A14100A-CQ256B | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256C | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256M | Microsemi | 35,000 | IC FPGA 228 I/O 256CQFP |
| A14100A-PG257B | Microsemi | 35,000 | IC FPGA 228 I/O 257CPGA |
| A14100A-PG257C | Microsemi | 35,000 | IC FPGA 228 I/O 257CPGA |
