Thermal - Heat Sinks
- Manufacturer:
-
- CUI Devices (2)
- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, BGA, 23 ... |
-
|
1,287
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK, BGA, 12 ... |
-
|
1,689
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK... |
-
|
29
In-stock
|
Get Quote |