Thermal - Heat Sinks
- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (3)
- DFRobot (2)
- Seeed (1)
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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9 Records
Image | Part | Manufacturer | Description | Price | Stock | Action | |
---|---|---|---|---|---|---|---|
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CUI Devices | HEAT SINK, EXTRUS... |
-
|
3,000
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
-
|
2,000
In-stock
|
Get Quote | ||
![]() |
Micro Connectors, Inc. | COOLING FAN/HS - R... |
-
|
500
In-stock
|
Get Quote | ||
![]() |
DFRobot | PURE COPPER HEAT... |
-
|
45
In-stock
|
Get Quote | ||
![]() |
DFRobot | RASPBERRY PI COP... |
-
|
35,000
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
-
|
35,000
In-stock
|
Get Quote | ||
![]() |
Seeed | ACTIVE HEAT SINK... |
-
|
35,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DPAK SM... |
-
|
35,000
In-stock
|
Get Quote | ||
![]() |
CTS Corporation | HEATSINK PRESS O... |
-
|
35,000
In-stock
|
Get Quote |