Thermal - Heat Sinks
- Manufacturer：
-
- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Type：
-
6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | BGA HEATSINK W/TA... |
-
|
167
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X21X23MM... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
-
|
35,000
In-stock
|
Get Quote |
