HONGLIXIN TECHNOLOGY ELECTRON LIMITED
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  6. BU180Z-178-HT
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    BU180Z-178-HT

    Mfr.Part #
    BU180Z-178-HT
    Manufacturer
    On-Shore Technology, Inc.
    Package/Case
    -
    Datasheet
    BU180Z-178-HT
    Description
    CONN IC DIP SOCKET 18POS GOLD
    Stock
    35000

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    Manufacturer :
    On-Shore Technology, Inc.
    Product Category :
    Sockets for ICs, Transistors > IC Sockets
    Contact Finish - Mating :
    Gold
    Contact Finish - Post :
    Copper
    Contact Finish Thickness - Mating :
    78.7µin (2.00µm)
    Contact Finish Thickness - Post :
    Flash
    Contact Material - Mating :
    Beryllium Copper
    Contact Material - Post :
    Brass
    Features :
    Open Frame
    Housing Material :
    Polybutylene Terephthalate (PBT), Glass Filled
    Mounting Type :
    Surface Mount
    Number of Positions or Pins (Grid) :
    18 (2 x 9)
    Operating Temperature :
    -55°C ~ 125°C
    Product Status :
    Obsolete
    Termination :
    Solder
    Datasheets
    BU180Z-178-HT

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