HSB0104YP-NTR-E
- Производитель-деталь №
- HSB0104YP-NTR-E
- Производитель
- Intersil (Renesas Electronics Corporation)
- Упаковка/футляр
- -
- Техническое описание
- HSB0104YP-NTR-E
- Описание
- SCHOTTKY BARRIER DIODE
- lang_0071
- 6000
Запросить предложение (ЗКП)
- * lang_0862:
- * Компания:
- * Электронная почта:
- * Телефон:
- * Комментарий:
- * Проверка кода:
-
- lang_0872 :
- Intersil (Renesas Electronics Corporation)
- Категория товара :
- Discrete Semiconductor Products > Diodes - Rectifiers - Arrays
- Current - Average Rectified (Io) (per Diode) :
- -
- Current - Reverse Leakage @ Vr :
- -
- Diode Configuration :
- -
- Diode Type :
- -
- Mounting Type :
- -
- Operating Temperature - Junction :
- -
- Package / Case :
- -
- Product Status :
- Active
- Reverse Recovery Time (trr) :
- -
- Speed :
- -
- Supplier Device Package :
- -
- Voltage - DC Reverse (Vr) (Max) :
- -
- Voltage - Forward (Vf) (Max) @ If :
- -
- lang_0258
- HSB0104YP-NTR-E
Продукты, связанные с производителем
Продукты, связанные с каталогом
Сопутствующие товары
| Деталь | Производитель | Склад | Описание |
|---|---|---|---|
| HSB01-080808 | CUI Devices | 35,000 | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
| HSB0104YPTL-E | Intersil (Renesas Electronics Corporation) | 111,092 | SCHOTTKY BARRIER DIODE |
| HSB0104YPTR-E | Intersil (Renesas Electronics Corporation) | 2,571 | SCHOTTKY BARRIER DIODE |
| HSB02-101007 | CUI Devices | 3,205 | HEAT SINK, BGA, 10 X 10 X 7 MM |
| HSB03-121218 | CUI Devices | 1,689 | HEAT SINK, BGA, 12 X 12 X 18 MM |
| HSB03-141406 | CUI Devices | 3,326 | HEAT SINK, BGA, 14 X 14 X 6 MM |
| HSB04-171706 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 6 MM |
| HSB05-171711 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 11.5 M |
| HSB06-181810 | CUI Devices | 780 | HEAT SINK, BGA, 18 X 18 X 10 MM |
| HSB07-202009 | CUI Devices | 35,000 | HEAT SINK, BGA, 20 X 20 X 9 MM |
| HSB08-212106 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 6 MM |
| HSB09-212115 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 15 MM |
