HSB10-232306

Производитель-деталь №
HSB10-232306
Производитель
CUI Devices
Упаковка/футляр
-
Техническое описание
HSB10-232306
Описание
HEAT SINK, BGA, 23 X 23 X 6 MM
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lang_0872 :
CUI Devices
Категория товара :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
3.0W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
9.60°C/W @ 200 LFM
Thermal Resistance @ Natural :
25.46°C/W
Type :
Top Mount
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HSB10-232306

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