HSB23-232325

Производитель-деталь №
HSB23-232325
Производитель
CUI Devices
Упаковка/футляр
-
Техническое описание
HSB23-232325
Описание
HEAT SINK, BGA, 23 X 23 X 25 MM
lang_0071
1202

Запросить предложение (ЗКП)

* lang_0862:
* Компания:
* Электронная почта:
* Телефон:
* Комментарий:
* Проверка кода:
loading...
lang_0872 :
CUI Devices
Категория товара :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
6.13W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
3.80°C/W @ 200 LFM
Thermal Resistance @ Natural :
12.23°C/W
Type :
Top Mount
lang_0258
HSB23-232325

Продукты, связанные с производителем

Продукты, связанные с каталогом

Сопутствующие товары

Деталь Производитель Склад Описание
HSB20-353525 CUI Devices 35,000 HEAT SINK, BGA, 35 X 35 X 25 MM
HSB21-454515 CUI Devices 35,000 HEAT SINK, BGA, 45 X 45 X 15 MM
HSB22-606010 CUI Devices 35,000 HEAT SINK, BGA, 60 X 60 X 10 MM
HSB226STL-E Intersil (Renesas Electronics Corporation) 32,500 SCHOTTKY BARRIER DIODE
HSB226WKTL-E Intersil (Renesas Electronics Corporation) 14,230 RECTIFIER DIODE, SCHOTTKY
HSB24-252510 CUI Devices 1,358 HEAT SINK, BGA,25 X 25 X 10 MM
HSB25-282810 CUI Devices 1,704 HEAT SINK, BGA, 28.5 X 28.5 X 10
HSB26-343408 CUI Devices 1,194 HEAT SINK, BGA, 33.5 X 33.5 X 8
HSB27-434316 CUI Devices 1,081 HEAT SINK, BGA, 43.1 X 43.1 X 16
HSB276ASTL-E Intersil (Renesas Electronics Corporation) 3,000 SCHOTTKY BARRIER DIODE
HSB276STL-E Intersil (Renesas Electronics Corporation) 33,000 SCHOTTKY BARRIER DIODE
HSB278STR-E Intersil (Renesas Electronics Corporation) 27,194 SCHOTTKY BARRIER DIODE
HSB28-606022 CUI Devices 223 HEAT SINK, BGA, 60 X 60 X 22 MM,
HSB2836JTR-E Intersil (Renesas Electronics Corporation) 30,000 PLANAR DIODE
HSB2836TL-E Intersil (Renesas Electronics Corporation) 39,000 DIODE FOR HIGH SPEED SWITCHING